Neenah Gessner’s lamination line is capable of combining substrates such as paper, wet- or dry-laid nonwovens and films, as well as any combination of these, into a final multi-layered material.

Two bonding technologies and a finely adjustable web tension system allow us to process many light weight materials, as well as substrates with high stretch.

An ultrasonic bonding system with its dot-array pattern is used to bond up to four layers in one process step. Alternatively, the adhesive unit can spray either hotmelt adhesive or reactive hotmelts for a full-surface lamination of two layers in one process step.